Title:
HIGH DENSITY RJ CONNECTOR ASSEMBLY
Document Type and Number:
WIPO Patent Application WO2002023680
Kind Code:
A8
Abstract:
A modular connector (10) having a housing (20) with one or more compartments (16), each compartment being structured and arranged to receive a plug. Within the housing are one or more conductive planes. Preferably, there are two conductive planes, a voltage source plane (44) and a voltage ground plane (46). These source and ground planes are provided on a printed circuit board (40) within the housing. The source and ground planes create a low impedance path for the source and ground connections by directly connecting the source and ground planes to a system printed circuit board of the equipment unit by a common voltage source pin (31) and a common voltage ground pin (31), each of which extend from the housing. The voltage source connections and the voltage ground connections for each RJ jack (15) are respectively connected to the voltage source plane and the voltage ground plane such that each of the RJ jacks (15) share a common voltage source and ground. Accordingly, when multiport RJ connectors (10) are formed, the use of the common source and ground planes operates to reduce the number of pins (31) in each RJ unit by requiring only one voltage source pin (31) and one voltage ground pin (31) regardless of the number of RJ jacks (15) in the multiport connector.
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Inventors:
BERNSTEIN ELLIOT DI
CHEN JOHN
CHEN JOHN
Application Number:
PCT/US2001/029190
Publication Date:
September 06, 2002
Filing Date:
September 18, 2001
Export Citation:
Assignee:
BEL FUSE INC (US)
International Classes:
H01R13/33; H01R12/16; H01R13/514; H01R13/648; (IPC1-7): H01R13/648
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