Title:
HIGH-FREQUENCY DEVICE AND DIRECTIONAL COUPLER
Document Type and Number:
WIPO Patent Application WO/2014/030469
Kind Code:
A1
Abstract:
This high-frequency device is provided with: a substrate that includes a plurality of stacked layers including dielectric layers and magnetic-body layers; terminals (P1, P2); a pattern conductors formed on a single layer; and a via conductor that passes through a single layer. The pattern conductor and the via conductor form a signal line for connecting the terminals (P1, P2) and transmitting a high-frequency signal. The first portion of the signal line includes a via conductor that passes through a single magnetic-body layer and/or a pattern conductor sandwiched between two magnetic-body layers, and has resistance to the high-frequency signal. The second portion of the signal line includes a capacitor formed by two pattern conductors so that a dielectric layer is sandwiched therebetween and a magnetic-body layer is not sandwiched therebetween, and/or an inductor that includes a pattern conductor formed on the dielectric layer. The high-frequency device has impedance with respect to the high-frequency signal at the terminals (P1, P2).
Inventors:
YAZAKI HIROKAZU (JP)
Application Number:
PCT/JP2013/069522
Publication Date:
February 27, 2014
Filing Date:
July 18, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/24; H01P1/23; H01P5/18; H03H7/01
Foreign References:
| JPH07192927A | 1995-07-28 | |||
| JPS5292401A | 1977-08-03 | |||
| JP2006191355A | 2006-07-20 | |||
| JP2009044303A | 2009-02-26 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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