Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/004604
Kind Code:
A1
Abstract:
A high-frequency dielectric heating adhesive sheet (1A) having an adhesive layer (10) containing at least a thermoplastic resin (A) and a dielectric material that generates heat due to the application of a high-frequency electric field, wherein: the adhesive layer (10) contains a silane-modified polyolefin as the thermoplastic resin (A); and the MFR of the thermoplastic resin (A) at 190°C is 2-50 g/10 min, inclusive.

More Like This:
JP7349381adhesive composition
JP4673306Composition useful as an adhesive for mounting vehicle windows
JP2009542860Conductive adhesive tape with different adhesiveness on both sides, and its manufacturing method
Inventors:
TAYA NAOKI (JP)
Application Number:
PCT/JP2021/024194
Publication Date:
January 06, 2022
Filing Date:
June 25, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/04; B29C65/36; C09J7/35; C09J123/26
Domestic Patent References:
WO2018147352A12018-08-16
WO2018079354A12018-05-03
WO2018147352A12018-08-16
Foreign References:
JP2003238745A2003-08-27
JP2020070367A2020-05-07
JP2018177825A2018-11-15
JP2003193009A2003-07-09
JP2004000977A2004-01-08
JP2002097445A2002-04-02
JP2016068426A2016-05-09
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: SENSING MAP SYSTEM, AND POSITIONING METHOD

Next Patent: HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE SHEET, JOINING METHOD, AND JOINED BODY