Title:
HIGH FREQUENCY ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2006/134774
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a high frequency electronic component being thin but exhibiting mechanical strength being excellent in electric insulation characteristics, and being remarkably low in dielectric loss. [MEANS FOR SOLVING PROBLEMS] The high frequency electronic component comprises conductor wiring for transmitting an electric signal of 100 MHz-100 GHz, and an insulation layer composed of a thermoplastic resin film containing cavities oriented in at least one direction by drawing, characterized in that the thermoplastic resin film containing cavities contains 3-45 vol% of cavities, the number of layers of cavities existing in the thickness direction of the film is 5 or above, and the density of the number of layers of cavities being defined by the following expression is in the range of 0.1-10 pieces/μm. Density of the number of layers of cavities (pieces/μm) = the number of layers of cavities (pieces) in film thickness direction/film thickness (μm)
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Inventors:
SASAKI YASUSHI (JP)
YOKOYAMA SEIICHIRO (JP)
YOKOYAMA SEIICHIRO (JP)
Application Number:
PCT/JP2006/310848
Publication Date:
December 21, 2006
Filing Date:
May 31, 2006
Export Citation:
Assignee:
TOYO BOSEKI (JP)
SASAKI YASUSHI (JP)
YOKOYAMA SEIICHIRO (JP)
SASAKI YASUSHI (JP)
YOKOYAMA SEIICHIRO (JP)
International Classes:
H01P3/08; C08J9/00; C08K3/00; C08K9/02; H01B7/08; H01B11/00; C08L67/00; H01B5/14
Foreign References:
| JP2002249669A | 2002-09-06 | |||
| JPH11255908A | 1999-09-21 | |||
| JP2004063326A | 2004-02-26 | |||
| JPH06126872A | 1994-05-10 | |||
| JP2003060116A | 2003-02-28 |
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