HIGH-FREQUENCY LAYERED PART AND MANUFACTURING METHOD THEREOF

Title:

HIGH-FREQUENCY LAYERED PART AND MANUFACTURING METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2004/064466

Kind Code:

A1

Abstract:

A high-frequency layered part used in a high-frequency device such as a radio communication device and a manufacturing method thereof. It is possible to reduce the size of the high-frequency layered part. In order to achieve this object, the high-frequency layered part includes a via hole electrode (3) formed in a dielectric body and a dielectric layer (4) formed around the via hole electrode (3) and having a lower dielectric constant than the other dielectric portion. By providing the dielectric layer (4) of the low dielectric constant, it is possible to suppress the electric interference between the via hole electrode (3) and a circuit electrode (22) present in the vicinity of it. Accordingly, it is possible to arrange the circuit electrode and the via hole electrode near from each other as compared to the conventional case, thereby enabling reduction of the size of the high-frequency layered part.

Inventors:

KUSHITANI HIROSHI (JP)
KAMEYAMA ICHIRO (JP)

Application Number:

PCT/JP2003/016426

Publication Date:

July 29, 2004

Filing Date:

December 22, 2003

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD (JP)
KUSHITANI HIROSHI (JP)
KAMEYAMA ICHIRO (JP)

International Classes:

H05K3/46; H01L23/12; H01L23/15; H01P1/04; H05K1/02; H05K1/11; H05K3/40; H01F17/00; H01F27/34; H01L23/498; H05K1/03; H05K3/00; (IPC1-7): H05K3/46; H01F27/00; H01G4/40; H01L23/12; H01P3/08; H05K1/11; H05K3/00; H05K3/40

Foreign References:

US5293502A	1994-03-08
EP0682363A2	1995-11-15
JPH0697671A	1994-04-08
US5454161A	1995-10-03
JPH1168275A	1999-03-09

Other References: