Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/240098
Kind Code:
A1
Abstract:
This high-frequency module (1A) comprises: a transmission power amplifier (11) which amplifies a high-frequency transmission signal in a communication band A; a transmission power amplifier (12) which amplifies a high-frequency transmission signal in a communication band C; and a module board (91) which has principal surfaces (91a and 91b) facing one another and upon which is mounted the transmission power amplifier (11) and transmission power amplifier (12). The transmission power amplifier (11) is positioned on one principal surface (91a) and the transmission power amplifier (12) is positioned on the other principal surface (91b).
Inventors:
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2019/022988
Publication Date:
December 19, 2019
Filing Date:
June 10, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H03H7/46; H03H9/70; H03H9/72; H04B1/50
Foreign References:
| US20150366099A1 | 2015-12-17 | |||
| JP2012070267A | 2012-04-05 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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