Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/123882
Kind Code:
A1
Abstract:
This high frequency module (1) comprises: a module substrate (91) having a main surface (91a); a first circuit component disposed on the main surface (91a); a resin member (92) disposed on the main surface (91a) and covering the side surface of the first circuit component; a metal shield layer (95) which is in contact with the top surface (92a) of the resin member (92) and the top surface of the first circuit component; and an engraved portion (80) provided on the top surface (92a) of the resin member (92). In the plan view of the main surface (91a), the engraved portion (80) does not overlap with the first circuit component.
Inventors:
TAKEMATSU YUJI (JP)
UEJIMA TAKANORI (JP)
NAKAGAWA DAI (JP)
UEJIMA TAKANORI (JP)
NAKAGAWA DAI (JP)
Application Number:
PCT/JP2021/036907
Publication Date:
June 16, 2022
Filing Date:
October 06, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/00; H01L23/00; H04B1/38
Domestic Patent References:
| WO2019167908A1 | 2019-09-06 |
Foreign References:
| JP2018195756A | 2018-12-06 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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