HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

WIPO Patent Application WO/2022/186131

A1

Provided is a high frequency module that is capable of improving heat dissipation in a power amplifier, and inhibiting heat from the power amplifier from affecting other electronic components. A high frequency module (1) comprises: a mounting board (30); a power amplifier (11) and a first electronic component (for example, a second switch (5)); a plurality of external connection terminals (34); and connection members (17). The mounting board (30) has a first main surface (30a) and a second main surface (30b) that face each other. The power amplifier (11) and the first electronic component are disposed on the second main surface (30b) of the mounting board (30). The plurality of external connection terminals (34) are disposed on the second main surface (30b) of the mounting board (30). The connection members (17) are capable of connecting with an external board (40). The plurality of external connection terminals (34) include first external connection terminals (34) connected to the connection members (17). The first external connection terminals (34) are disposed between the power amplifier (11) and the first electronic component.

ONO ATSUSHI
KISHIMOTO MASANORI
SUKEMORI YOSHIAKI
KOGUSHI YOSHIKI
SHIMAMOTO KENICHI
NAMIE HISANORI

PCT/JP2022/008274

September 09, 2022

February 28, 2022

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MURATA MANUFACTURING CO (JP)

H01L25/04; H01L23/12; H01L25/18; H04B1/38

WO2021002454A1	2021-01-07
WO2020071021A1	2020-04-09
WO2019181761A1	2019-09-26
WO2019181590A1	2019-09-26

JP2020126921A	2020-08-20
JP2015111747A	2015-06-18
JP2011198866A	2011-10-06

HOKUTO PATENT ATTORNEYS OFFICE (JP)

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