Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/270330
Kind Code:
A1
Abstract:
In the present invention, deterioration in characteristics of a filter is reduced. In a high-frequency module (500), a filter includes: a first substrate; a first function electrode (11) that is provided on the first substrate and that constitutes a part of an antenna terminal resonator (14A); a second substrate separated from the first substrate; and a second function electrode that is provided on the second substrate and that constitutes a part of at least one elastic wave resonator other than the antenna terminal resonator (14A) among a plurality of elastic wave resonators. A first electronic component (E1) including the first substrate and the first function electrode (11) is disposed on the first main surface (111) of a mounting substrate (110). An inductor (4) is adjacent to the first electronic component (E1) in a plan view from the thickness direction of the mounting substrate (110). The inductor (4) does not overlap the antenna terminal resonator (14A) in a side view from the direction of a winding shaft (A4) of a winding portion.
More Like This:
Inventors:
TAKAYANAGI SHINICHIRO
KITA TERUMICHI
ITO TAKANORI
KITA TERUMICHI
ITO TAKANORI
Application Number:
PCT/JP2022/023412
Publication Date:
December 29, 2022
Filing Date:
June 10, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/46; H01F17/04; H03H7/01; H03H9/64; H04B1/38
Domestic Patent References:
WO2019111695A1 | 2019-06-13 | |||
WO2019138813A1 | 2019-07-18 | |||
WO2016056377A1 | 2016-04-14 |
Foreign References:
US20200235716A1 | 2020-07-23 | |||
JP2015115671A | 2015-06-22 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
Download PDF:
Previous Patent: INFORMATION PROCESSING SYSTEM, COMPUTER SYSTEM, AND PROGRAM
Next Patent: INJECTION MOLDING SYSTEM
Next Patent: INJECTION MOLDING SYSTEM