Title:
HIGH-FREQUENCY MODULE, COMMUNICATION DEVICE, AND FILTER
Document Type and Number:
WIPO Patent Application WO/2023/199860
Kind Code:
A1
Abstract:
The present invention suppresses degradation of the characteristics of a filter. In a filter (1) of a high-frequency module (500), a first chip (10) is disposed on a mounting substrate (9), and a second chip (20) is disposed on the first chip (10). The first chip (10) has a first resonator (11). The second chip (20) has a second resonator (12). In the filter (1), the first resonator (11) and the second resonator (12) face each other in a thickness direction (D1) of the mounting substrate (9). The first chip (10) has a first through-via conductor (V1), a second through-via conductor (V2), a first wiring portion (W1), and a second wiring portion (W2). The first through-via conductor (V1) is interposed between a first terminal (41) and a first connecting conductor portion (31). A distance (Le2) between the second through-via conductor (V2) and the first through-via conductor (V1) is shorter than a distance (Le1) between the first wiring portion (W1) and the first through-via conductor (V1).
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Inventors:
FUJIMORI EIJI
Application Number:
PCT/JP2023/014386
Publication Date:
October 19, 2023
Filing Date:
April 07, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145; H03H9/64; H04B1/38
Domestic Patent References:
| WO2021060444A1 | 2021-04-01 |
Foreign References:
| JP2007202130A | 2007-08-09 | |||
| JP2020043442A | 2020-03-19 | |||
| CN111600565A | 2020-08-28 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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