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Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2012/043429
Kind Code:
A1
Abstract:
A high-frequency module is realized that enables isolation to be increased between a transmission-side circuit and a reception-side circuit of a duplexer, and that facilitates miniaturization. The high-frequency module (10) comprises a switching element (SWIC), and duplexers (DUP1,DUP2,DUP3). The duplexer (DUP1) is comprised of SAW filters (SAWut1,SAWur1), the duplexer (DUP2) is comprised of SAW filters (SAWut2,SAWur2), and the duplexer (DUP3) is comprised of SAW filters (SAWut3,SAWur3). The SAW filters (SAWut1,SAWut2,SAWut3) are mounted proximal to one edge of a stack (900). The SAW filters (SAWur1,SAWur2,SAWur3) are mounted proximal to another edge on an opposing side to the one edge of the stack (900). The switching element (SWIC) is mounted in the center of the stack (900).

Inventors:
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2011/071791
Publication Date:
April 05, 2012
Filing Date:
September 26, 2011
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
UEJIMA TAKANORI (JP)
International Classes:
H04B1/40; H03H9/72
Domestic Patent References:
WO2003036806A12003-05-01
Foreign References:
JP2009531882A2009-09-03
JP2005073086A2005-03-17
JP2006246234A2006-09-14
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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