Title:
HIGH-FREQUENCY MODULE
Document Type and Number:
WIPO Patent Application WO/2023/037799
Kind Code:
A1
Abstract:
A high-frequency module (100) that comprises a dielectric substrate (10), a coating resin (20), an electronic component (21) that is installed via a plurality of bumps (40), and a plurality of conductor pillars (30). The plurality of conductor pillars (30) include a signal conductor pillar (31a) that is adjacent to the electronic component (21) and conducts a high-frequency signal and ground conductor pillars (32) that are adjacent to the signal conductor pillar (31a). The plurality of bumps (40) include ground bumps (41) that are connected to the ground conductor pillars (32). As seen from the direction orthogonal to the xy plane, the circle (R) that has its center (C) at the center axis of the signal conductor pillar (31a) and has a radius that is the distance from the center to the furthest point (P) on ground conductor pillar (32z) overlaps at least a portion of the ground bump (41a) that is closest to the signal conductor pillar (31a).
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Inventors:
GOUCHI NAOKI (JP)
Application Number:
PCT/JP2022/029828
Publication Date:
March 16, 2023
Filing Date:
August 03, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/08; H01L23/12
Foreign References:
| US20200294939A1 | 2020-09-17 | |||
| JP2019102660A | 2019-06-24 | |||
| JP2017103447A | 2017-06-08 | |||
| JP2006108182A | 2006-04-20 | |||
| JP2004071961A | 2004-03-04 | |||
| JPH0992651A | 1997-04-04 | |||
| JPH0541463A | 1993-02-19 | |||
| JPH0537208A | 1993-02-12 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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