Title:
HIGH PRECISION HIGH RELIABILITY AND QUICK RESPONSE THERMOSENSITIVE CHIP AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2016/015594
Kind Code:
A1
Abstract:
The present invention relates to the technical field of thermosensitive chip products. Provided are a high precision high reliability and quick response thermosensitive chip and manufacturing method thereof, comprising a thermosensitive ceramic semiconductor substrate (1); glass protective layers (2) are alternately spray-coated and sintered on the two surfaces of the thermosensitive ceramic semiconductor substrate (1); and the two surfaces of the thermosensitive ceramic semiconductor substrate (1) having the glass protective layers (2) are printed with metal electrode layers (3). The thermosensitive chip achieves quick response, accurate control of resistance precision and has high precision; in addition, the glass protective layers thereof enable the thermosensitive chip to have high reliability.
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Inventors:
CHEN WENTING (CN)
DUAN ZHAOXIANG (CN)
YANG JUN (CN)
BAI QIXING (CN)
TANG LIMIN (CN)
YE JIANKAI (CN)
DUAN ZHAOXIANG (CN)
YANG JUN (CN)
BAI QIXING (CN)
TANG LIMIN (CN)
YE JIANKAI (CN)
Application Number:
PCT/CN2015/084974
Publication Date:
February 04, 2016
Filing Date:
July 23, 2015
Export Citation:
Assignee:
EXSENSE ELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
G01K7/22; H01C7/04
Domestic Patent References:
| WO2013017531A1 | 2013-02-07 |
Foreign References:
| JPH0851002A | 1996-02-20 | |||
| CN102034580A | 2011-04-27 | |||
| CN104198079A | 2014-12-10 | |||
| CN1624819A | 2005-06-08 | |||
| CN102052972A | 2011-05-11 | |||
| CN102627446A | 2012-08-08 |
Attorney, Agent or Firm:
GUANGZHOU SINO PATENT & TRADEMARK AGENT CO., LTD (CN)
广州新诺专利商标事务所有限公司 (CN)
广州新诺专利商标事务所有限公司 (CN)
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