Title:
HIGH-RELIABILITY LOW-INDUCTANCE POWER MODULE PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/098822
Kind Code:
A1
Abstract:
Disclosed in the present application is a power module packaging structure, comprising: a package housing, which comprises a first surface and a second surface, wherein the first surface and the second surface are respectively located on an upper side and a lower side of the package housing; a substrate, which is packaged in the package housing and is parallel to the first surface and the second surface, wherein at least one power element is arranged on the substrate; and a plurality of absorption terminals, which are arranged on the first surface and are respectively connected to a first power supply end and a second power supply end of the at least one power element inside the package housing. The plurality of absorption terminals are coupled to an absorption circuit by means of soldering or bonding, and the absorption circuit is used for eliminating an internal inductance that is generated by the connection between the at least one power element and the plurality of absorption terminals and an external inductance that is generated by the connection between the first power supply end and the second power supply end, as well as an external power supply.
Inventors:
YE NAN (CN)
LI DAOHUI (CN)
LI DAOHUI (CN)
Application Number:
PCT/CN2022/135923
Publication Date:
June 08, 2023
Filing Date:
December 01, 2022
Export Citation:
Assignee:
SHANGHAI XPT TECH LTD (CN)
International Classes:
H01L23/367; H01L23/528
Domestic Patent References:
| WO2019163114A1 | 2019-08-29 |
Foreign References:
| CN104604114A | 2015-05-06 | |||
| CN113497014A | 2021-10-12 | |||
| CN206976342U | 2018-02-06 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (HK) LTD. (CN)
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