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Patent Searching and Data


Title:
HIGH-SPEED BLISTER PACKAGING MACHINE
Document Type and Number:
WIPO Patent Application WO/2023/159874
Kind Code:
A1
Abstract:
The present invention relates to a novel high-speed blister packaging machine. The high-speed blister packaging machine comprises a rack. The rack is sequentially provided with a blister support molding device, a molding traction device, a blister heat sealing device, a heat sealing traction device, a blister punching device and a blister grid conveying device. The high-speed blister packaging machine is characterized in that: a blister cooling device is provided between the blister heat sealing device and the heat sealing traction device; the blister cooling device comprises a cooling box and a cooling plate; the cooling plate is arranged in the cooling box; and a cooling channel which allows the blister to pass through is arranged below the cooling plate. The high-speed blister packaging machine can quickly cool a heat-sealed blister, such that the blister is not deformed when the heat sealing traction device pulls the blister.

Inventors:
LI WENLEI (CN)
LI JUNJIE (CN)
MAO JIANLIN (CN)
DONG FA (CN)
GUO FANGTING (CN)
YANG YIFU (CN)
Application Number:
PCT/CN2022/109322
Publication Date:
August 31, 2023
Filing Date:
July 31, 2022
Export Citation:
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Assignee:
ZHEJIANG HOPING MACHINERY CO LTD (CN)
International Classes:
B65B51/32; B65B11/52; B65B61/06
Foreign References:
CN114671091A2022-06-28
CN212401663U2021-01-26
CN209064468U2019-07-05
CN112093173A2020-12-18
CN110422413A2019-11-08
CN213292896U2021-05-28
CN106956817A2017-07-18
CN201296405Y2009-08-26
JP2008001408A2008-01-10
Attorney, Agent or Firm:
RUIAN XIANGDONG INTELLECTUAL PROPERTY OFFICE (CN)
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