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Title:
HOLLOW PARTICLES, RESIN COMPOSITION, AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2024/048093
Kind Code:
A1
Abstract:
Provided are hollow particles having reduced dielectric loss tangent and improved performance stability. The hollow particles each comprise a shell containing at least one polymer and a hollow part surrounded by the shell. The contained amount of noncrosslinkable monomer units in 100 mass% of all monomer units forming the polymer contained in the shell is 15-60 mass%. The hollow particles exhibit a dielectric loss tangent of 5.00×10-4 or less at a frequency of 10 GHz.

Inventors:
MORIMURA MIKI (JP)
Application Number:
PCT/JP2023/026013
Publication Date:
March 07, 2024
Filing Date:
July 14, 2023
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
C08L101/00; C08F2/18; C08F2/44; C08F212/36; C08K7/22
Domestic Patent References:
WO2022107674A12022-05-27
WO2022092076A12022-05-05
WO2023074651A12023-05-04
WO2023106307A12023-06-15
Foreign References:
JP2022096299A2022-06-29
Attorney, Agent or Firm:
KISHIMOTO, Tatsuhito et al. (JP)
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