Title:
HOLLOW RESIN PARTICLES FOR SEMICONDUCTOR MEMBER RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/130938
Kind Code:
A1
Abstract:
The present invention provides styrene-based hollow resin particles for a semiconductor member resin composition that make it possible to provide a semiconductor member that achieves excellent low dielectric characteristics as a result of using the semiconductor member resin composition. According to the embodiments, the hollow resin particles for a semiconductor member resin composition have a shell part and a hollow portion that is enclosed by the shell part, the total concentration of the lithium, sodium, potassium, and magnesium included in the hollow resin particles being no more than 200 mg/kg.
Inventors:
MATSUURA HARUHIKO (JP)
OKAMOTO KOICHIRO (JP)
OKAMOTO KOICHIRO (JP)
Application Number:
PCT/JP2021/043435
Publication Date:
June 23, 2022
Filing Date:
November 26, 2021
Export Citation:
Assignee:
SEKISUI KASEI CO LTD (JP)
International Classes:
C08F2/24; C08F20/26; C08F2/44; C08F212/08; C08F212/36; H01L23/00
Domestic Patent References:
| WO2011040376A1 | 2011-04-07 | |||
| WO2021085189A1 | 2021-05-06 |
Foreign References:
| JP2000313818A | 2000-11-14 | |||
| JP2000311518A | 2000-11-07 | |||
| JP2011094124A | 2011-05-12 | |||
| JP2016069619A | 2016-05-09 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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