HOLLOW RESIN PARTICLES FOR SEMICONDUCTOR MEMBER RESIN COMPOSITION

Title:

HOLLOW RESIN PARTICLES FOR SEMICONDUCTOR MEMBER RESIN COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2022/130939

Kind Code:

A1

Abstract:

The present invention provides styrene-based hollow resin particles for a semiconductor member resin composition that have excellent heat resistance and low water absorption.　According to the embodiments, the hollow resin particles for a semiconductor member resin composition: have a shell part and a hollow portion that is enclosed by the shell part; and have an ethylenically unsaturated group retention rate of 1%–20%.

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WO/2011/136237	POLYACRYLIC ACID (SALT), POLYACRYLIC ACID (SALT)-BASED WATER-ABSORBING RESIN, AND PROCESS FOR PRODUCING SAME
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Inventors:

MATSUURA HARUHIKO (JP)
OKAMOTO KOICHIRO (JP)

Application Number:

PCT/JP2021/043436

Publication Date:

June 23, 2022

Filing Date:

November 26, 2021

Export Citation:

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Assignee:

SEKISUI KASEI CO LTD (JP)

International Classes:

C08F20/06; C08F2/24; C08F2/44; C08F212/08; C08F212/36; H01L23/00

Domestic Patent References:

WO2011040376A1	2011-04-07
WO2021085189A1	2021-05-06

Foreign References:

JP2000313818A	2000-11-14
JP2000311518A	2000-11-07

Attorney, Agent or Firm:

MOMII Takafumi (JP)

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