Title:
HOT-MELT ADHESIVE AGENT
Document Type and Number:
WIPO Patent Application WO/2016/031170
Kind Code:
A1
Abstract:
To provide a hot-melt adhesive agent which can be coated at low temperature, and has excellent creep resistance, and a disposable product obtained by employing the hot-melt adhesive agent. A hot-melt adhesive agent comprising a thermoplastic block copolymer (A) which is a copolymer of vinyl-based aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises the following component (A1) and component (A2): (A1) a radial type styrene block copolymer having a styrene content of 35 to 45% by weight, a diblock content of 50 to 90% by weight, and a viscosity at 25oC as a 25% by weight toluene solution of not more than 250 mPa・s; and (A2) a linear type styrene block copolymer having a styrene content of 40 to 50% by weight, and a viscosity at 25oC as a 25% by weight toluene solution of not more than 250 mPa・s.
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Inventors:
KIYOHARA TAKESHI (JP)
Application Number:
PCT/JP2015/004057
Publication Date:
March 03, 2016
Filing Date:
August 17, 2015
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
International Classes:
C09J153/02
Domestic Patent References:
WO2014175410A1 | 2014-10-30 | |||
WO2014189150A1 | 2014-11-27 | |||
WO2014157220A1 | 2014-10-02 |
Foreign References:
EP1564275A1 | 2005-08-17 | |||
JP2005255993A | 2005-09-22 | |||
JP2006008947A | 2006-01-12 | |||
JP2010506005A | 2010-02-25 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, JP)
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