Title:
HOT MELT TYPE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING ELECTRODE LAYER, MULTILAYER BODY COMPRISING ELECTRODE LAYER, USE OF SAME AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2024/071151
Kind Code:
A1
Abstract:
[Problem] To provide: a composition for forming an electrode layer, the composition being able to be applied by a hot melt process and being capable of forming an electrode layer which exhibits extremely excellent adhesion and followability to a dielectric layer and extremely excellent shape retainability, and which has practically sufficient viscoelastic characteristics and is not susceptible to separation and defects even if used in a transducer; a multilayer body; use of the multilayer body; and a method for producing the multilayer body. [Solution] A hot melt type organopolysiloxane composition for forming an electrode layer, the hot melt type organopolysiloxane composition containing (A) a chain organopolysiloxane, (B) an MQ-type organopolysiloxane resin which has a weight average molecular weight of 5,000 or more in terms of standard polystyrene, and (E) conductive fine particles, and being non-fluid at 25°C, while having heat fusibility, wherein the content of the component (B) in the composition is 45% by mass or more relative to the entirety of the composition.
Inventors:
FUKUI HIROSHI (JP)
Application Number:
PCT/JP2023/035044
Publication Date:
April 04, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/07; B32B27/00; B32B27/18; C08K3/04; C08L83/04; C08L83/05
Domestic Patent References:
| WO2020203305A1 | 2020-10-08 | |||
| WO2022004462A1 | 2022-01-06 |
Foreign References:
| JP2022501459A | 2022-01-06 | |||
| JP2016503108A | 2016-02-01 | |||
| JP2016505693A | 2016-02-25 |
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