Title:
CURABLE ORGANOPOLYSILOXANE COMPOSITION FOR FORMING ELECTRODE LAYER, MULTILAYER BODY COMPRISING ELECTRODE LAYER, USE OF SAME AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2024/071150
Kind Code:
A1
Abstract:
[Problem] To provide: a composition for forming an electrode layer, the composition being capable of forming, through a curing reaction, an electrode layer which has a low temperature dependence of the viscoelasticity, while exhibiting extremely excellent adhesion and conformability to a dielectric layer and extremely excellent shape retainability, and which is not susceptible to separation and defects even if used in a transducer, and has practically sufficient viscoelastic characteristics; a multilayer body; use of the multilayer body; and a method for producing the multilayer body. [Solution] A curable organopolysiloxane composition for forming an electrode layer, the curable organopolysiloxane composition containing (A) a chain organopolysiloxane which has, at least at both molecular chain ends, curing-reactive functional groups each having a carbon-carbon double bond, (B) an MQ-type organopolysiloxane resin which has a weight average molecular weight of 5,000 or more in terms of standard polystyrene, and (E) conductive fine particles such as single-walled carbon nanotubes (SWCNT), wherein the content of component (B) in the composition is less than 45% by mass relative to the entirety of the composition.
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Inventors:
FUKUI HIROSHI (JP)
Application Number:
PCT/JP2023/035043
Publication Date:
April 04, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/07; B32B27/00; B32B27/18; C08K3/04; C08L83/05
Domestic Patent References:
| WO2022004462A1 | 2022-01-06 | |||
| WO2020116440A1 | 2020-06-11 |
Foreign References:
| JP2022501459A | 2022-01-06 | |||
| JP2016503108A | 2016-02-01 | |||
| JP2016505693A | 2016-02-25 |
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