Title:
HYPERTROPHIC SCAR INHIBITING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/235292
Kind Code:
A1
Abstract:
This hypertrophic scar inhibiting composition contains at least one of polypeptides comprising an amino acid sequence having the dipeptide sequence represented by Pro-Hyp or Hyp-Gly, chemically modified products thereof and pharmaceutically acceptable salts thereof.
Inventors:
JIMI SHIRO (JP)
KIMURA MASAHIKO (JP)
INOUE NAOKI (JP)
SHIMIZU MAIKO (JP)
KOIZUMI SEIKO (JP)
KIMURA MASAHIKO (JP)
INOUE NAOKI (JP)
SHIMIZU MAIKO (JP)
KOIZUMI SEIKO (JP)
Application Number:
PCT/JP2019/020997
Publication Date:
December 12, 2019
Filing Date:
May 28, 2019
Export Citation:
Assignee:
UNIV FUKUOKA (JP)
NITTA GELATIN KK (JP)
NITTA GELATIN KK (JP)
International Classes:
A61K38/05; A61K38/04; A61K38/39; A61P17/02
Foreign References:
JP2010195714A | 2010-09-09 | |||
JP2005289819A | 2005-10-20 | |||
JP2016532694A | 2016-10-20 | |||
JP2016169199A | 2016-09-23 | |||
JP2016169163A | 2016-09-23 | |||
JP5385282B2 | 2014-01-08 | |||
JP2005289937A | 2005-10-20 |
Other References:
KIMURA MASAHIKO: "Effectiveness of wound healing under mechanical stress load by Pro-Hyp administration (non official translation )", ABSTRACTS AND PROGRAMS OF THE 50TH CONFERENCE OF THE JAPANESE SOCIETY FOR MATRIX BIOLOGY AND MEDICINE, 1 June 2018 (2018-06-01), pages 114
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
Download PDF:
Previous Patent: GAS SAFETY DEVICE
Next Patent: THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME
Next Patent: THERMALLY CONDUCTIVE SILICONE COMPOSITION AND METHOD FOR PRODUCING SAME