Title:
IC CHIP MOUNTED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2007/052761
Kind Code:
A1
Abstract:
In a liquid crystal driver mounted package (1a), a film substrate (2) and a liquid crystal
driver (3) are connected through a driver socket (4a). Connection terminals on
the film substrate (2) side of the driver socket (4a) have a pitch larger than that
of connection terminals on the liquid crystal driver (3) side. Since wiring (5,
6) on the film of the film substrate (2) can be formed by using an existing technology, the
liquid crystal drivers (3) can be formed with a finer pitch by using a microfabrication process.
Inventors:
MURAHASHI SHUNICHI
NISHIOKA HIROSHI
HORINOUCHI KAZUYUKI
NISHIOKA HIROSHI
HORINOUCHI KAZUYUKI
Application Number:
PCT/JP2006/321998
Publication Date:
May 10, 2007
Filing Date:
November 02, 2006
Export Citation:
Assignee:
SHARP KK (JP)
MURAHASHI SHUNICHI
NISHIOKA HIROSHI
HORINOUCHI KAZUYUKI
MURAHASHI SHUNICHI
NISHIOKA HIROSHI
HORINOUCHI KAZUYUKI
International Classes:
H01L23/12; H01L21/60; H01L23/14
Foreign References:
| JP2004207566A | 2004-07-22 | |||
| JP2000340617A | 2000-12-08 | |||
| JP2002222830A | 2002-08-09 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (2-6 Tenjinbashi 2-chome Kita, Kita-ku, Osaka-sh, Osaka 41, JP)
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