IMAGE PICKUP DEVICE

WIPO Patent Application WO/2019/069559

A1

This image pickup device comprises a first structure 20 and a second structure 40. The first structure 20 is provided with a first substrate 21, a temperature detection element, which is formed on the first substrate 21, and which detects temperature on the basis of infrared light, a signal line 71, and a drive line 72. The second structure 40 is provided with a second substrate 41, and a drive circuit, which is provided on the second substrate 41, and which is covered with a cover layer 43. The first substrate 21 and a second electrode 41 are laminated to each other, the signal line 71 is electrically connected to the drive circuit via a signal line connecting section 100, the drive line is electrically connected to the drive circuit via a drive line connecting section, and the signal line connecting section 100 comprises a first signal line connecting section 102 formed in the first structure 20, and a second signal line connecting section 106 formed in the second structure 40.

JP2022189971	IMAGE PICK-UP DEVICE
JP5278165	Focus detector, image sensor and electronic camera
JPH07112057	[Title of Invention] Solid-state image sensor

HOSAKA HAJIME (JP)
OKUMURA KENICHI (JP)
NITTA YOSHIKAZU (JP)

PCT/JP2018/030065

April 11, 2019

August 10, 2018

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SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

H04N5/369; G01J1/02; H01L27/144; H01L27/146; H04N5/33; H04N5/374

WO2015159766A1

2015-10-22

JP2013057582A	2013-03-28
JP2014007201A	2014-01-16
JP2007171170A	2007-07-05
JPH07169931A	1995-07-04
JP2013195313A	2013-09-30
JP2016039393A	2016-03-22
JP2011082450A	2011-04-21
JP2013115289A	2013-06-10

YAMAMOTO Takahisa et al. (JP)

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