Title:
IMAGE PROCESSING METHOD AND DEVICE FOR SEMICONDUCTOR ELECTRON BEAM DEFECT MONITORING, AND SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/060797
Kind Code:
A1
Abstract:
An image processing method and device for semiconductor electron beam defect monitoring, and a system. The method comprises steps of: S100, acquiring an original image, and performing filtering processing on the original image to obtain a filtered image; S200, acquiring the filtered image, and using an alignment algorithm to perform alignment processing on the filtered image to obtain a template image; S300, performing image subtraction operation on the template image and a preset reference image to obtain a difference image; and S400, calculating the variance of the difference image, and performing comparison and determination on the variance and a preset value to acquire and output a comparison and determination result. The image processing method can improve the success rate of image alignment in a defect detection process, unnecessary details in image alignment are removed by filtering, and the alignment result is accurately determined by using a difference image, such that multiple alignment algorithms can be used in a crossed mode to exert respective advantages, thereby improving the accuracy of the alignment algorithm.
Inventors:
CHEN CHEN (CN)
Application Number:
PCT/CN2022/071604
Publication Date:
April 20, 2023
Filing Date:
January 12, 2022
Export Citation:
Assignee:
DONGFANG JINGYUAN MICROELECTRONICS TECH BEIJING CO LTD (CN)
International Classes:
G06T3/00; G06T7/00; G06T5/20; G06T5/50
Foreign References:
| CN101303533A | 2008-11-12 | |||
| US20080036899A1 | 2008-02-14 | |||
| CN108648168A | 2018-10-12 | |||
| CN1695166A | 2005-11-09 | |||
| CN109934802A | 2019-06-25 | |||
| US20130064470A1 | 2013-03-14 | |||
| CN111340753A | 2020-06-26 |
Attorney, Agent or Firm:
BEIJING DINGLI DONGSHEN INTELLECTUAL PROPERTY AGENCY CO., LTD (CN)
Download PDF: