Title:
IMAGE SENSOR DEVICE, APPARATUS, AND METHOD FOR MANUFACTURING IMAGE SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/105921
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide an image sensor device capable of reducing the risk of damage and/or contamination to constituent components during manufacture. The image sensor device according to the present disclosure comprises a substrate, and a plurality of sensor units arranged side by side in at least one axial direction on the substrate, each of the plurality of sensor units including a pixel chip having a plurality of pixels, and a translucent cover that covers the pixel chip. The image sensor device according to the present disclosure makes it possible to provide an image sensor device capable of reducing the risk of damage and/or contamination to constituent components during manufacture.
Inventors:
SUZUKI MASAMI (JP)
Application Number:
PCT/JP2022/038249
Publication Date:
June 15, 2023
Filing Date:
October 13, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N1/028
Foreign References:
| JP2019519967A | 2019-07-11 | |||
| JP2014534611A | 2014-12-18 | |||
| JP2019160866A | 2019-09-19 | |||
| JP2017183386A | 2017-10-05 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
Download PDF: