Title:
IMAGING APPARATUS AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/145606
Kind Code:
A1
Abstract:
Provided is an imaging apparatus comprising semiconductor substrate (300) and a plurality of imaging elements (100) that are arranged in a matrix on the semiconductor substrate and that perform photoelectric conversion on incident light, each of the plurality of imaging elements being provided adjacent to each other within a predetermined unit region of the semiconductor substrate and having a plurality of pixels (302a, 302b) having photoelectric conversion parts and a pixel-separating part (304) separating the plurality of pixels, the pixel-separating parts being provided so as to pass through at least part of the semiconductor substrate along the thickness direction of the semiconductor substrate, and at least one surface among the surfaces having the pixel-separating parts being a surface with recesses and protrusions.
Inventors:
SATO NAOYUKI (JP)
MIYOSHI YASUFUMI (JP)
OHSHIMA KEIJI (JP)
FUKASAWA MASANAGA (JP)
MIYOSHI YASUFUMI (JP)
OHSHIMA KEIJI (JP)
FUKASAWA MASANAGA (JP)
Application Number:
PCT/JP2023/001543
Publication Date:
August 03, 2023
Filing Date:
January 19, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N25/70
Domestic Patent References:
| WO2021251270A1 | 2021-12-16 | |||
| WO2018150902A1 | 2018-08-23 |
Foreign References:
| JP2020077650A | 2020-05-21 | |||
| US20160043119A1 | 2016-02-11 | |||
| US20190132506A1 | 2019-05-02 | |||
| JP2020065026A | 2020-04-23 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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