Title:
IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/189579
Kind Code:
A1
Abstract:
The present technology relates to an imaging device and an electronic apparatus with which it is possible to suppress generation of stray light components and improve image quality. The present technology comprises a chip on which a photoelectric conversion element is formed, a cover glass, a first joining part by which the chip and the cover glass are joined, and a second joining part joined to the first joining part and the chip. A joining surface where the first and second joining parts are joined is positioned parallel to the cover glass. The present technology can be applied, for example, to a packaged imaging device.
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Inventors:
MATSUSHITA AKIHIRO (JP)
MAKITA YOSHIHIRO (JP)
OHIRA HIKARU (JP)
MAKITA YOSHIHIRO (JP)
OHIRA HIKARU (JP)
Application Number:
PCT/JP2023/010001
Publication Date:
October 05, 2023
Filing Date:
March 15, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Domestic Patent References:
| WO2020026639A1 | 2020-02-06 |
Foreign References:
| US20200052019A1 | 2020-02-13 | |||
| US20060035415A1 | 2006-02-16 | |||
| CN111211140A | 2020-05-29 | |||
| JP2002033468A | 2002-01-31 | |||
| JP2012169528A | 2012-09-06 | |||
| JP2018038054A | 2018-03-08 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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