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Title:
IN-MOLD TRANSFER MOLDING FILM AND METHOD FOR MANUFACTURING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/243290
Kind Code:
A1
Abstract:
Provided is an in-mold transfer molding film, which has excellent moldability, post-molding electroconductivity and electromagnetic wave shielding properties and that features good productivity. Also provided is a method for manufacturing a molded article. The in-mold transfer molding film comprises a substrate film, a release layer, and an electroconductive layer, in this order. The electroconductive layer contains, with respect to the electroconductive layer which is 100 mass%, particles at 60-91 mass%, and contains a resin at 9-40 mass%. The weight average molecular weight of the resin is at least 5,000 but less than 10,000. The particles include at least one type selected from the group consisting of non-valent carbon, silver, gold, copper, nickel, chrome, palladium, indium, aluminum, zinc and platinum.

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Inventors:
KITAMURA YUTAKA (JP)
Application Number:
PCT/JP2023/018267
Publication Date:
December 21, 2023
Filing Date:
May 16, 2023
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B27/18; B29C45/14; H05K9/00
Domestic Patent References:
WO2020137284A12020-07-02
WO2020203659A12020-10-08
Foreign References:
JP2012201016A2012-10-22
JP2018069525A2018-05-10
JP2021192960A2021-12-23
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