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Title:
INCLINATION ADJUSTING DEVICE AND PATTERN FORMING DEVICE WITH INCLINATION ADJUSTING FUNCTION
Document Type and Number:
WIPO Patent Application WO/2006/011576
Kind Code:
A1
Abstract:
An inclination adjusting device adjusting the inclination of a mold with a specified pattern relative to a work in a pattern forming device pressing the mold against the work to transfer the pattern of the mold to the work. The tilt adjusting device is characterized by comprising a projected spherical surface seat having a projected spherical surface with a fixed inclination relative to the mold, a recessed spherical surface seat having a recessed spherical surface of the same diameter as that of the projected spherical surface, having a fixed inclination relative to the work, and brought into contact with the projected spherical surface, and a displacement means displacing the projected spherical surface relative to the recessed spherical surface.

Inventors:
KUSUURA TAKAHISA (JP)
GOTO HIROSHI (JP)
KOBAYASHI NAOKI (JP)
Application Number:
PCT/JP2005/013880
Publication Date:
February 02, 2006
Filing Date:
July 28, 2005
Export Citation:
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Assignee:
SCIVAX CORP (JP)
HAKUTO KK (JP)
ENGINEERING SYSTEM CO LTD (JP)
KUSUURA TAKAHISA (JP)
GOTO HIROSHI (JP)
KOBAYASHI NAOKI (JP)
International Classes:
H01L21/027; B29C59/02; B30B15/06; B81C99/00; B82B3/00
Foreign References:
JP2004146601A2004-05-20
JP2004103232A2004-04-02
JP2005129791A2005-05-19
JP2005007848A2005-01-13
JP2001135634A2001-05-18
Attorney, Agent or Firm:
Gocho, Tatsushi (Acropolis 21 Bldg. 4-10, Higashinihonbashi 3-chom, Chuo-ku Tokyo 04, JP)
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