INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR MANUFACTURING INDIUM PHOSPHIDE SUBSTRATE

Title:

INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR MANUFACTURING INDIUM PHOSPHIDE SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2021/019887

Kind Code:

A1

Abstract:

Provided are: an indium phosphide substrate having a superior accuracy of flatness of an orientation flat; and a method for manufacturing an indium phosphide substrate using the same. This indium phosphide substrate is characterized by having a main surface and an orientation flat, wherein: when in a surface excluding a 3 mm-width inward portion from both ends of an orientation flat end surface in the longitudinal direction of the orientation flat end surface, four cross-sectional curves are set at intervals of 1/5 of the substrate thickness, and the maximum heights Pz specified according to JIS B 0601:2013 are measured on the four curves, the difference between the maximum value and the minimum value of the maximum heights Pz on the four cross-sectional curve is no greater than 1.50/10,000 of the longitudinal length of the orientation flat end surface.

Inventors:

ITANI KENYA (JP)
KURITA HIDEKI (JP)
HAYASHI HIDEAKI (JP)

Application Number:

PCT/JP2020/020789

Publication Date:

February 04, 2021

Filing Date:

May 26, 2020

Export Citation:

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Assignee:

JX NIPPON MINING & METALS CORP (JP)

International Classes:

H01L21/304; C30B29/40; H01L21/306

Foreign References:

JP2003100575A	2003-04-04
JP2001267235A	2001-09-28
JPH041417B2	1992-01-13
JP2014028723A	2014-02-13

Other References: