Title:
INFORMATION PROCESSING DEVICE, INFERENCE DEVICE, MACHINE LEARNING DEVICE, INFORMATION PROCESSING METHOD, INFERENCE METHOD, AND MACHINE LEARNING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/029236
Kind Code:
A1
Abstract:
[Problem] To provide an information processing device that makes it possible to appropriately predict reliability information of a polishing end-point detection function, the reliability information indicating the reliability of an end-point detection function for detecting that a chemical mechanical polishing process has reached the end point. [Solution] An information processing device 5 comprises: an information acquisition unit 500 that acquires reliability decrease cause state information during a chemical mechanical polishing process being performed on a substrate by a substrate processing device 2, the reliability decrease cause state information including at least one of wear state information indicating the state of wear of a constituent element of the substrate processing device 2, and processing state information indicating processing state during the polishing process; and a state prediction unit 501 that inputs the reliability decrease cause state information acquired by the information acquisition unit 500 into a learning model that has learned, by machine learning, the correlation between the reliability decrease cause state information and reliability information of a polishing end-point detection function indicating the reliability of an end-point detection function for detecting that the chemical mechanical polishing process has reached an end point, thereby predicting the reliability information of the polishing end-point detection function with respect to the reliability decrease cause state information.
Inventors:
MITANI RYUICHIRO (JP)
Application Number:
PCT/JP2023/023932
Publication Date:
February 08, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/013; B24B49/12
Domestic Patent References:
| WO2020235581A1 | 2020-11-26 |
Foreign References:
| JP2013176828A | 2013-09-09 |
Attorney, Agent or Firm:
AOYAMA Jun et al. (JP)
Download PDF:
Previous Patent: SEMICONDUCTOR DEVICE
Next Patent: SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Next Patent: SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE