Title:
INNER-LAYER STRIP-SHAPED POWER DIVIDER CIRCUIT AND POWER DIVIDER SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/280083
Kind Code:
A1
Abstract:
Embodiments of the present application relate to the technical field of microwave component design, and disclose an inner-layer strip-shaped power divider circuit, which comprises a multi-layer circuit board (10) and a first power divider (20) disposed on the multi-layer circuit board (10). The first power divider (20) comprises: a power divider body (21), which is disposed on an inner layer of the multi-layer circuit board (10), the power divider body (21) comprising an input port (210), a transmission line (211) connected to the input port (210), and two output ports (212) connected to the transmission line (211); an isolation resistor (22), which is disposed on a surface layer of the multi-layer circuit board (10); and a via hole (23), the via hole (23) penetrating through at least two conductive metal layers of the multi-layer circuit board (10) and electrically connecting the transmission line (211) to the isolation resistor (22). Further provided in the embodiments of the present application is a power divider system. The inner-layer strip-shaped power divider circuit and the power divider system provided in the embodiments of the present application can simultaneously meet design requirements of a power divider for convenient processing and a high degree of isolation.
Inventors:
WANG BAOJIE (CN)
ZENG WU (CN)
ZENG WU (CN)
Application Number:
PCT/CN2022/103494
Publication Date:
January 12, 2023
Filing Date:
July 01, 2022
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
H01P5/16
Foreign References:
| CN109314300A | 2019-02-05 | |||
| US3662294A | 1972-05-09 | |||
| US7164903B1 | 2007-01-16 | |||
| CN107681242A | 2018-02-09 | |||
| CN110277623A | 2019-09-24 |
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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