Title:
INSULATING ADHESIVE FILM MATERIAL, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/120715
Kind Code:
A1
Abstract:
Disclosed are an insulating adhesive film material, a preparation method therefor and an application thereof; the insulating adhesive film material comprises an insulating polymer composite layer, and the insulating polymer composite layer is made of an electronic paste. The electronic paste is made from the following raw material components: a resin polymer, a first curing agent, a curing accelerator, an inorganic filler material that uses a second curing agent for surface treatment, a dispersant, an additive, and a solvent; and the second curing agent is a liquid curing agent or a curing agent solution, the mass of a solute in the liquid curing agent or the curing agent solution being 0.01-5% of the mass of the inorganic filler material. The insulating adhesive film material of the present invention can be applied to a semiconductor electronic package such as a printed circuit board (PCB), a substrate, a carrier board, achieving the fabrication of a fine electronic circuit.
Inventors:
LUO SUIBIN (CN)
YU JUNYI (CN)
YU SHUHUI (CN)
XU PENGPENG (CN)
LIU JIE (CN)
SUN RONG (CN)
YU JUNYI (CN)
YU SHUHUI (CN)
XU PENGPENG (CN)
LIU JIE (CN)
SUN RONG (CN)
Application Number:
PCT/CN2020/135258
Publication Date:
June 16, 2022
Filing Date:
December 10, 2020
Export Citation:
Assignee:
SHENZHEN INST ADV TECH (CN)
International Classes:
H01L23/29; B32B27/08; C08J5/18; C08K3/22; C08K3/36; C08K7/18; C08K9/04; C08L63/00; C09J7/00; C09J11/04; C09J11/06; C09J163/00
Foreign References:
| CN110511718A | 2019-11-29 | |||
| JPH0450256A | 1992-02-19 | |||
| KR20060077794A | 2006-07-05 | |||
| JPH0827361A | 1996-01-30 | |||
| CN101878240A | 2010-11-03 | |||
| JPH06283633A | 1994-10-07 | |||
| CN1405261A | 2003-03-26 | |||
| CN104053721A | 2014-09-17 | |||
| CN103222040A | 2013-07-24 |
Attorney, Agent or Firm:
BEIJING CHENGHUI LAW FIRM (CN)
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