Title:
INSULATIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/053560
Kind Code:
A1
Abstract:
An insulative adhesive tape (3) is configured from a laminated body (L3) of at least three layers including an insulative layer (12), an adhesive layer (13), and a substrate layer (11) provided between the insulative layer (12) and the adhesive layer (13). The insulative layer (12) and the adhesive layer (13) are each provided to the surface of the laminated body (L3), and the insulative layer (12) is formed of a resin including, as a main component, at least one selected from a polyamide and a polyimide having an aromatic ring concentration of 30 mass% or less.
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Inventors:
FUKUZAWA HIDEMOTO (JP)
TAKAHASHI ATSUSHI (JP)
NAKAMURA MINORU (JP)
SAKAGUCHI GO (JP)
TAKAHASHI ATSUSHI (JP)
NAKAMURA MINORU (JP)
SAKAGUCHI GO (JP)
Application Number:
PCT/JP2022/020093
Publication Date:
April 06, 2023
Filing Date:
May 12, 2022
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
B32B27/00; B32B27/34; C09J7/38; C09J201/00
Domestic Patent References:
| WO2010100874A1 | 2010-09-10 | |||
| WO2014174838A1 | 2014-10-30 |
Foreign References:
| JP2006219565A | 2006-08-24 | |||
| JP2018035211A | 2018-03-08 | |||
| JPH02281504A | 1990-11-19 | |||
| JPH0473824A | 1992-03-09 | |||
| JPH107997A | 1998-01-13 | |||
| JP2010031101A | 2010-02-12 | |||
| JP2020026450A | 2020-02-20 | |||
| JP2021070824A | 2021-05-06 | |||
| JP2021127438A | 2021-09-02 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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