Title:
INTEGRATED CIRCUIT, METHOD OF TESTING INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2002/063675
Kind Code:
A1
Abstract:
A spiral conductor pattern is formed on an insulating film over an integrated circuit chip. One end of the pattern is connected to an input and output terminal of a test circuit. The test circuit has input and output circuits that include a transmitting circuit for driving the conductor pattern as an induction coil or an antenna to transmit a signal, and a receiving circuit for detecting the changes in current or voltage of the conductor pattern to discriminate an external signal to the induction coil or the antenna. Data is transferred to and from an external control device in noncontact manner.
Inventors:
HISHINUMA MASAYOSHI (JP)
SATOH MASAYUKI (JP)
SATOH MASAYUKI (JP)
Application Number:
PCT/JP2001/000756
Publication Date:
August 15, 2002
Filing Date:
February 02, 2001
Export Citation:
Assignee:
HITACHI LTD (JP)
HISHINUMA MASAYOSHI (JP)
SATOH MASAYUKI (JP)
HISHINUMA MASAYOSHI (JP)
SATOH MASAYUKI (JP)
International Classes:
H01L23/58; (IPC1-7): H01L21/66
Foreign References:
| JP2000208571A | 2000-07-28 | |||
| JPH0727832A | 1995-01-31 |
Attorney, Agent or Firm:
Obinata, Tomio (Kagurazaka 3-chome Shinjuku-ku, Tokyo, JP)
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