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Title:
INTEGRATED MICROWAVE PHOTON TRANSCEIVING FRONT-END FOR PHASED ARRAY SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/128666
Kind Code:
A1
Abstract:
The present invention relates to the technical field of microwave techniques and photoelectrons, and particularly relates to an integrated microwave photon transceiving front-end for a phased array system. The front-end comprises a ceramic substrate, and a control integrated circuit, a silicon-based photonic integrated chip, a first amplifier chipset, a second amplifier chipset, and a microwave switch chipset supported on the ceramic substrate. The control integrated circuit controls, by an input control signal, the silicon-based photonic integrated chip and the microwave switch chipset. The silicon-based photonic integrated chip has one end connected to an input/output optical fiber and another end connected to the first amplifier chipset and the second amplifier chipset. The two amplifier chipsets are respectively connected to the microwave switch chipset, and the microwave switch chipset is further connected to a phased array antenna. The invention achieves zero beam pointing deviation in an ultra-wide band, thereby enabling phased array systems to operate in a large operation frequency range or at a high instantaneous bandwidth while having a reduced size.

Inventors:
ZHANG YU (CN)
LIANG XU (CN)
XU JING (CN)
SUN LIJUN (CN)
Application Number:
PCT/CN2020/086082
Publication Date:
July 01, 2021
Filing Date:
April 22, 2020
Export Citation:
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Assignee:
CHINA ELECTRONICS TECH GROUP CORPORATION NO 44 RESEARCH INSTITUTE (CN)
International Classes:
H04B10/2575; H04B7/04
Domestic Patent References:
WO2018128662A22018-07-12
Foreign References:
CN104092485A2014-10-08
CN106230516A2016-12-14
CN103941235A2014-07-23
Attorney, Agent or Firm:
CHONGQING PHEATON LAWFIRM (CN)
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