Title:
INTEGRATED PACKAGED MODULE MANUFACTURING METHOD, INTEGRATED PACKAGED MODULE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/088496
Kind Code:
A1
Abstract:
Provided in the present invention are an integrated packaged module manufacturing method, an integrated packaged module, and an electronic device. The integrated packaged module manufacturing method comprises the following steps: assembling a plurality of first electronic components onto a first face of a prefabricated PCB board, wherein a through hole is arranged on the PCB board; performing deposition of a packaging material on a portion or all of the first electronic components on the first face of the PCB board, and forming a first packaging layer, the first packaging layer not covering the through hole; assembling a MEMS speaker having a sound emission region on a second face of the PCB board, wherein the second face is arranged opposite the first face; performing deposition of a packaging material on the MEMS speaker on the second face of the PCB board, and forming a second packaging layer, wherein the second packaging layer does not overlap with the sound emission region. The present invention saves more structural space for an electronic device using a MEMS speaker, allowing for further improvement in miniaturization of the electronic device.
Inventors:
DAN QIANG (CN)
LI YANG (CN)
LI YANG (CN)
Application Number:
PCT/CN2020/142157
Publication Date:
May 05, 2022
Filing Date:
December 31, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC MICROTECH CHANGZHOU CO LTD (CN)
AAC MICROTECH CHANGZHOU CO LTD (CN)
International Classes:
H04R31/00; H04R19/02
Foreign References:
| CN112004180A | 2020-11-27 | |||
| CN109661367A | 2019-04-19 | |||
| CN204714514U | 2015-10-21 | |||
| CN104394496A | 2015-03-04 | |||
| US20180302727A1 | 2018-10-18 | |||
| CN111083622A | 2020-04-28 |
Attorney, Agent or Firm:
SHENZHEN JUNXINCHENG INTELLECTUAL PROPERTY FIRM (GENERAL PARTNERSHIP) (CN)
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