Title:
INTERPOSER, MODULE, AND METHOD FOR PRODUCING INTERPOSER
Document Type and Number:
WIPO Patent Application WO/2016/117245
Kind Code:
A1
Abstract:
The present invention achieves an interposer that is capable of handling various pitch conversions and is inexpensive in comparison with conventional interposers. The interposer comprises: a resin layer on one surface of which is provided a connection terminal for connecting to a main substrate; and a glass sheet fixed along another surface of the resin layer. At least one portion of a surface of the glass sheet not opposing the resin layer is exposed from the resin layer and constitutes an exposed portion. A connection terminal for connecting to a semiconductor element is provided on a surface of the exposed portion, and wiring for interconnecting the connection terminal and an end of the exposed portion is formed on a surface of the exposed portion.
Inventors:
SATO JUNICHI (JP)
Application Number:
PCT/JP2015/085182
Publication Date:
July 28, 2016
Filing Date:
December 16, 2015
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H01L23/15; H01L23/12; H01L23/14; H05K3/46
Domestic Patent References:
| WO2009028596A1 | 2009-03-05 |
Foreign References:
| JP2004111415A | 2004-04-08 |
Attorney, Agent or Firm:
MATSUO KENICHIRO (JP)
Ken-ichiro Matsuo (JP)
Ken-ichiro Matsuo (JP)
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