JET SOLDER BATH AND SOLDERING APPARATUS

WIPO Patent Application WO/2010/131752

A1

Provided are a jet solder bath and a soldering apparatus, wherein an liquid level error can be reduced and soldering failures can be eliminated. An operating unit sets the liquid level of a melted solder (20). An arm (81) is at a level that corresponds to the liquid level set by means of the operating unit for the melted solder (20) and moves to above a nozzle (53). An electrical continuity sensor (82) is provided on an arm (81), is moved to above the nozzle (53) by means of the arm (81), and detects that the liquid surface reached the level when the sensor is in contact with the liquid surface of the melted solder (20) jetted from the nozzle (53). Thus, the liquid level of the melted solder (20), which is jetted from the nozzle (53) to be soldered on a printed substrate, can be adjusted. As a result, since the liquid level of the melted solder (20) jetted from the nozzle (53) can be adjusted, the error of the liquid level of the melted solder (20) can be reduced compared with conventional jet solder baths wherein the liquid level of the melted solder is indirectly adjusted using sub-nozzles and dummy nozzles, and soldering failures can be eliminated.

OHSHIMIZU KAZUNORI (JP)
TAKAGUCHI AKIRA (JP)
HASHIMOTO NOBORU (JP)

PCT/JP2010/058231

November 18, 2010

May 14, 2010

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DENSO CORP (JP)
SENJU METAL INDUSTRY CO (JP)
OHSHIMIZU KAZUNORI (JP)
TAKAGUCHI AKIRA (JP)
HASHIMOTO NOBORU (JP)

B23K1/08; B23K1/00; B23K3/06; H05K3/34; B23K101/42

JPS6052667U	1985-04-13
JPH095012A	1997-01-10
JPS6195768A	1986-05-14
JPS4990651A	1974-08-29

YAMAGUCHI Kunio et al. (JP)
Kunio Yamaguchi (JP)

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