Title:
SPRAY FLUXER DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/131751
Kind Code:
A1
Abstract:
Flux is supplied to the entire interior of a through-hole provided in a printed substrate, and the area coated by the flux is increased. A first and a second nozzle (11, 12) are adjacent to each other in the X direction, and so that the areas coated by the first and second nozzles (11, 12) do not overlap, spray outlets (11b, 12b) are disposed at positions separated in the Y direction by just a prescribed distance A1. The first and second nozzles (11, 12) spray flux while moving in the X direction. Thus the first and second nozzles (11, 12) can be moved close to the printed substrate to coat said substrate. As a result, flux can be supplied to the entire interior of a through-hole provided in the printed substrate, and the area coated by the flux can be increased.
Inventors:
OHSHIMIZU KAZUNORI (JP)
TAKAGUCHI AKIRA (JP)
HASHIMOTO NOBORU (JP)
TAKAGUCHI AKIRA (JP)
HASHIMOTO NOBORU (JP)
Application Number:
PCT/JP2010/058230
Publication Date:
November 18, 2010
Filing Date:
May 14, 2010
Export Citation:
Assignee:
DENSO CORP (JP)
SENJU METAL INDUSTRY CO (JP)
OHSHIMIZU KAZUNORI (JP)
TAKAGUCHI AKIRA (JP)
HASHIMOTO NOBORU (JP)
SENJU METAL INDUSTRY CO (JP)
OHSHIMIZU KAZUNORI (JP)
TAKAGUCHI AKIRA (JP)
HASHIMOTO NOBORU (JP)
International Classes:
H05K3/34; B23K3/00; B05B13/04
Foreign References:
| JP2000165026A | 2000-06-16 | |||
| JP2006218337A | 2006-08-24 | |||
| JPH0459171A | 1992-02-26 | |||
| JP3069484U | 2000-06-23 |
Attorney, Agent or Firm:
YAMAGUCHI Kunio et al. (JP)
Kunio Yamaguchi (JP)
Kunio Yamaguchi (JP)
Download PDF:
Claims:
Previous Patent: SIMULATOR DEVICE AND SIMULATING METHOD
Next Patent: JET SOLDER BATH AND SOLDERING APPARATUS
Next Patent: JET SOLDER BATH AND SOLDERING APPARATUS