Title:
JOINT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2006/135061
Kind Code:
A1
Abstract:
[PROBLEMS] To provide a joint structure composed of two or more structures which has an excellent joint at the joint area between the structures and which serves as a microstructure or micro-component. [MEANS FOR SOLVING PROBLEMS] A joint structure manufactured by jointing a first structure with a second structure at the smooth surfaces of the structures opposed from each other to form a micro-structure or the like, at least one of the first and second structures being made of a resin composition comprising a polypropylene resin and a hydrogenated derivative of a block copolymer represented by the general formula: X-Y, an alkoxy or alkoxysilane compound or a mixture of an alkoxy or alkoxysilane compound with a hydrogenated derivative of a block copolymer represented by the general formula: X-Y being applied onto the joint area between the first and second structures and adhered to each other with heating (in the formula: X-Y, X represents a polymer block incompatible with the polypropylene resin and Y represents an elastomeric polymer block of a conjugated diene.
Inventors:
YAMASHITA KAZUYUKI (JP)
OMOTANI MIEKO (JP)
ONAGA TAKASHI (JP)
HIMI KIYOKAZU (JP)
OMOTANI MIEKO (JP)
ONAGA TAKASHI (JP)
HIMI KIYOKAZU (JP)
Application Number:
PCT/JP2006/312165
Publication Date:
December 21, 2006
Filing Date:
June 16, 2006
Export Citation:
Assignee:
RICHELL CORP (JP)
TOYAMA PREFECTURE (JP)
YAMASHITA KAZUYUKI (JP)
OMOTANI MIEKO (JP)
ONAGA TAKASHI (JP)
HIMI KIYOKAZU (JP)
TOYAMA PREFECTURE (JP)
YAMASHITA KAZUYUKI (JP)
OMOTANI MIEKO (JP)
ONAGA TAKASHI (JP)
HIMI KIYOKAZU (JP)
International Classes:
B32B27/32; B01J19/00; B32B9/00; B81B1/00; C09J153/00; C09J183/00
Foreign References:
JPH02158643A | 1990-06-19 | |||
JPH06287365A | 1994-10-11 | |||
JPH06171022A | 1994-06-21 | |||
JP3515784B2 | 2004-04-05 |
Other References:
See also references of EP 1900513A4
Attorney, Agent or Firm:
Otani, Kaichi (Suehirocho Takaoka-sh, Toyama 23, JP)
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