Title:
LAMINATE BODY, TEMPORARY ADHESION COMPOSITION, AND TEMPORARY ADHESION FILM
Document Type and Number:
WIPO Patent Application WO/2016/152599
Kind Code:
A1
Abstract:
A laminate body, a temporary adhesive composition and a temporary adhesion film are provided which can make warpage less prone to occur even when a wafer is thin. This laminate body comprises, in order and adjacent to each other, a first substrate, a temporary adhesion film and a second substrate. At 25°C, the temporary adhesion film has a modulus of elasticity in tension E of 25-2000 MPa, in accordance with JIS K 7161:1994. One substrate of the laminate body, either the first substrate or the second substrate, is fixed at the temperature of 25°C. The end portion of the other substrate can be separated by lifting said end portion of the other substrate away from the interface with the temporary adhesion film at a speed of 50 mm/m in the direction perpendicular to the surface of said other substrate, and the force applied during said lifting is less than or equal to 0.33 N/mm when measured with a force gauge.
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Inventors:
KAMOCHI YOSHITAKA (JP)
IWAI YU (JP)
SAWANO MITSURU (JP)
KOYAMA ICHIRO (JP)
NAKAMURA ATSUSHI (BE)
IWAI YU (JP)
SAWANO MITSURU (JP)
KOYAMA ICHIRO (JP)
NAKAMURA ATSUSHI (BE)
Application Number:
PCT/JP2016/057906
Publication Date:
September 29, 2016
Filing Date:
March 14, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B7/12; C09J7/00; B32B27/00; C09J201/00; H01L21/301
Foreign References:
| JP2011091220A | 2011-05-06 | |||
| JP2002220571A | 2002-08-09 | |||
| JP2014037458A | 2014-02-27 | |||
| US20120171844A1 | 2012-07-05 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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