Title:
LAMINATE, DEVICE, RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED PRODUCT, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120314
Kind Code:
A1
Abstract:
The present invention provides: a laminate comprising a cured product obtained by curing a film containing a base provided with metal wiring, a cyclized resin or a precursor thereof, and a photosensitive agent, the dielectric constant of the cured product being 3.0 or less, and the cured product contacting at least a portion of the metal wiring; a device provided with the laminate; a resin composition in which the cured product is obtained even after exposure to high-humidity conditions, said cured product having excellent adhesion with metal; a cured product comprising the resin composition and a method for manufacturing said cured product; a method for manufacturing the laminate including the cured product; and a method for manufacturing a device including the cured product or the laminate.
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Inventors:
KOIZUMI TAKANORI (JP)
OOTA KAZUYA (JP)
OOTA KAZUYA (JP)
Application Number:
PCT/JP2022/046014
Publication Date:
June 29, 2023
Filing Date:
December 14, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H05K3/28; B32B15/08; B32B27/00; G03F7/004; G03F7/027; G03F7/037; G03F7/20; H01L21/312
Foreign References:
| JP2001254014A | 2001-09-18 | |||
| JP2016020488A | 2016-02-04 | |||
| JP2005538548A | 2005-12-15 | |||
| JP2011225756A | 2011-11-10 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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