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Title:
LAMINATE, HEAT-DISSIPATING SUBSTRATE, AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/190659
Kind Code:
A1
Abstract:
This laminate (1) comprises a metal substrate (2) and an amorphous inorganic insulating layer (3) in the stated order in the thickness direction.

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WO/2023/190662LAMINATE, HEAT-DISSIPATING SUBSTRATE, AND METHOD FOR PRODUCING LAMINATE
Inventors:
TAKAKURA HAYATO (JP)
ISHIKAWA TAKETO (JP)
Application Number:
PCT/JP2023/012757
Publication Date:
October 05, 2023
Filing Date:
March 29, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/05
Foreign References:
JPS6221247A1987-01-29
JPS5815241A1983-01-28
JP2015141987A2015-08-03
JP2017028019A2017-02-02
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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