Title:
LAMINATE MANUFACTURING METHOD AND MANUFACTURING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/048752
Kind Code:
A1
Abstract:
A laminate manufacturing method of the present disclosure comprises: a detection step for detecting, by means of a predetermined detection device (20), a defect portion (82) of a band-shaped material (81) to be processed that is fed from a to-be-processed material coil (80) that is in a wound state; a processing step for using a die (31) of a processing device (30) to perform punching on the material (81) to be processed being intermittently transferred; and a laminating/dispensing step for stacking punched-out pieces (85, 86) punched out by the processing step into a laminated state, and successively feeding laminates (91, 92), each comprising the plurality of punched-out pieces (85, 86) laminated together, from the processing device (30) onto predetermined transfer paths (71, 72). In the laminating/dispensing step, on the basis of the result of detection of the defect portion (82) in the detection step, if a laminate (91, 92) includes a punched-out piece (85, 86) having a defect portion (88), the thickness of the laminate (91, 92) is made different from that of the normal time when the punched-out piece (85, 86) having the defect portion (88) is not included.
Inventors:
SASAKI KATSUHIRO (JP)
NAGAI AKIRA (JP)
MIZUNO KIYOSHI (JP)
KATO GO (JP)
NAGAI AKIRA (JP)
MIZUNO KIYOSHI (JP)
KATO GO (JP)
Application Number:
PCT/JP2023/031956
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
Assignee:
MITSUI HIGH TEC (JP)
International Classes:
B21D28/02; B21D43/22
Foreign References:
| JPS5425705B2 | 1979-08-30 | |||
| JP2019041474A | 2019-03-14 | |||
| JP2021097492A | 2021-06-24 | |||
| JP2020054115A | 2020-04-02 |
Attorney, Agent or Firm:
SHIN-EI, P.C. (JP)
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