Title:
LAMINATE AND METAL-CLAD LAMINATE BOARD HAVING SAID LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/157369
Kind Code:
A1
Abstract:
Provided is a metal-clad laminate board (for example, a copper-clad laminate board (CCL)) that, while having good electric characteristics (dielectric characteristics) adapted to 5G, has an excellent bonding property (adhesive property) between a base material film (laminate) and a metal film and has excellent dimensional stability, and of which curling is suppressed. Also, provided is a laminate for a printed wiring board that is used to form the above metal-clad laminate board. The laminate comprises: a low CTE resin film that has a linear coefficient of thermal expansion (CTE) of 50 ppm/℃ or less and does not have a melting point at or below 300℃; and resin films (SPS resin films) made of a styrene-based polymer having a syndiotactic structure (SPS) that are laminated on both surfaces of the low CTE resin film.
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Inventors:
KOIZUMI AKIHIRO (JP)
YOSHIDA KAZUYOSHI (JP)
YOSHIDA KAZUYOSHI (JP)
Application Number:
PCT/JP2022/036101
Publication Date:
August 24, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
SHIN ETSU POLYMER CO LTD (JP)
International Classes:
B32B7/027; B29C63/02; B29C65/44; B32B15/08; B32B27/30; H05K1/03
Foreign References:
| JP2002076581A | 2002-03-15 | |||
| JP2011051203A | 2011-03-17 | |||
| JPH0664090A | 1994-03-08 | |||
| JP2021195539A | 2021-12-27 | |||
| JP2022169444A | 2022-11-09 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi et al. (JP)
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