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Title:
LAMINATE, PACKAGE, AND PACKAGED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/033159
Kind Code:
A1
Abstract:
Provided is a laminate mainly comprising a polyethylene and having excellent heat resistance. A laminate (10A) has a substrate layer (2), an adhesive layer (5), and a sealant layer (6) in this order, wherein: the substrate layer (2) and the sealant layer (6) include a polyethylene; and the absolute value of the degree of molecular orientation of the substrate layer (2) as measured by the microwave method is at least 1.07.

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Inventors:
KITAHARA TSUKASA (JP)
SHIOKAWA SHUNICHI (JP)
SHIMIZU NOBUYUKI (JP)
RO KAZUYOSHI (JP)
Application Number:
PCT/JP2022/033185
Publication Date:
March 09, 2023
Filing Date:
September 02, 2022
Export Citation:
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Assignee:
TOPPAN INC (JP)
International Classes:
B32B9/00; B32B7/03; B32B27/00; B32B27/32; B32B27/40; B65D65/40
Domestic Patent References:
WO2019189092A12019-10-03
WO2021176948A12021-09-10
WO2022131264A12022-06-23
Foreign References:
JP2020157514A2020-10-01
JP2020158192A2020-10-01
JP2020157729A2020-10-01
JP2021054078A2021-04-08
Attorney, Agent or Firm:
SUZUYE & SUZUYE (JP)
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