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Title:
LAMINATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD USING SAME, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, ELECTRICAL COMPONENT, ELECTRONIC COMPONENT, AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2007/052660
Kind Code:
A1
Abstract:
Disclosed is a laminate characterized by having, on a supporting body, an insulating resin composition layer which is capable of producing a reactive active species when provided with energy and a reactive polymer precursor layer containing a compound which is capable of forming a polymer compound by reacting with the insulating resin composition layer.

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JPS62116145SYNTHETIC-RESIN HOLLOW BODY
Inventors:
TSURUMI MITSUYUKI (JP)
Application Number:
PCT/JP2006/321752
Publication Date:
May 10, 2007
Filing Date:
October 31, 2006
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
TSURUMI MITSUYUKI (JP)
International Classes:
B32B27/08; B32B27/16; H05K1/03; H05K3/18
Domestic Patent References:
WO2003024174A12003-03-20
Foreign References:
JP2005037881A2005-02-10
JP2003213437A2003-07-30
JPS58196238A1983-11-15
JPH09214140A1997-08-15
JP2001345537A2001-12-14
JPH11344804A1999-12-14
JP2003068146A2003-03-07
JP2005307140A2005-11-04
JPH04259381A1992-09-14
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (NAKAJIMA & KATO Seventh Floor HK-Shinjuku Bldg., 3-1, Shinjuku 4-chome Shinjuku-ku Tokyo 22, JP)
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