Title:
LAMINATE, RESIN COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/210155
Kind Code:
A1
Abstract:
Provided is a laminate that allows semiconductor elements to be transferred over a wide range of processing margins using lasers of various wavelengths, without damaging the elements or leaving behind any pasty residue. This laminate is a substrate in which a laser-transmitting substrate 1, a resin film, and a semiconductor element are laminated in the stated order. The absorbance of the resin film at a wavelength of 248 nm, 266 nm, or 355 nm expressed in terms of a film thickness of 1.0 μm us 0.4-5.0, and the adhesive strength of the resin film with respect to the semiconductor elements is 0.02-0.3 N/cm.
Inventors:
ARIMOTO YUKARI (JP)
NAKAJIMA RISANO (JP)
KOSHINO MIKA (JP)
ARAKI HITOSHI (JP)
TOMIKAWA MASAO (JP)
FUJIWARA TAKENORI (JP)
AOSHIMA KENTA (JP)
NAKAJIMA RISANO (JP)
KOSHINO MIKA (JP)
ARAKI HITOSHI (JP)
TOMIKAWA MASAO (JP)
FUJIWARA TAKENORI (JP)
AOSHIMA KENTA (JP)
Application Number:
PCT/JP2022/013454
Publication Date:
October 06, 2022
Filing Date:
March 23, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
B32B27/00; H01L21/02; H01L21/52; H01L23/14
Foreign References:
| JPH11281804A | 1999-10-15 | |||
| JP2020188037A | 2020-11-19 | |||
| JP2014515883A | 2014-07-03 | |||
| JP2017531915A | 2017-10-26 | |||
| JP2020129638A | 2020-08-27 | |||
| JP2020188037A | 2020-11-19 | |||
| JP2010251359A | 2010-11-04 | |||
| JP2014515883W | ||||
| JP3120476B2 | 2000-12-25 |
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